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The DSi uses a 256MB Samsung moviNAND flash chip, which is a NAND flash chip with a built-in controller that implements a MMC (SDIO) interface. In many ways, it's like an SD card in BGA packaging, and some people have successfully read it with modified SD card readers.
The DSi uses a 256MB Samsung moviNAND flash chip, which is a NAND flash chip with a built-in controller that implements a MMC (SDIO) interface. In many ways, it's like an SD card in BGA packaging, and some people have successfully read it with modified SD card readers. The last 16MB is used for wear-leveling purposes (such as replacing bad blocks), while the first 240MB is used for storing actual data.
Addressing is done in terms of 512-bytes sectors. All wear-levelling and bad-block-mapping is handled transparently inside the chip by the controller. Most sectors are encrypted with a per-console key.
Addressing is done in terms of 512-bytes sectors. All wear-levelling and bad-block-mapping is handled transparently inside the chip by the controller. Most sectors are encrypted with a per-console key.
! Offset !! Size !! Description
! Offset !! Size !! Description
|-
|-
| 0 || 0x200 || PC-style MBR, encrypted with a per-console key
| 0 || 0x200 || PC-style Master Boot Record (MBR), encrypted with a per-console key
|-
|-
| 0x200 || 0x200 || Stage 2 info block 1 (see below)
| 0x200 || 0x200 || Stage 2 info block 1 (see [[Bootloader]])
|-
|-
| 0x400 || 0x200 || Stage 2 info block 2
| 0x400 || 0x200 || Stage 2 info block 2